Description
Loctite 452116 Epoxy Semi Encapsulant, Eccobond FP4460 Series, 30mL Syringe
LOCTITE ECCOBOND FP4460 encapsulant is designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on the device and package type. High-performance LOCTITE ECCOBOND FP4460 Encapsulant designed for protecting semiconductor devices. Offers excellent thermal stability, moisture resistance, and mechanical strength. Order now to experience quality and reliability.
High purity
Low stress
Improved work life
High temperature performance
Excellent chemical resistance
Excellent moisture resistance
High flow
Cure: Heat cure
Series: LOCTITE® ECCOBOND FP4460
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: henkel-loctite-adhesive-sourcebook.pdf
