Description
XCKU3P-2FFVB676I Xilinx Kintex UltraScale+ Field Programmable Gate Array (FPGA) IC 0.825-0.876V 280I/O 676-BBGA, FCBGA Tray
The AMD UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through innovative technological advancements.
Kintex™ UltraScale FPGAs: High-performance with a focus on price/performance, using both monolithic and stacked silicon interconnect (SSI)
technology. High DSP and block RAM-to-logic ratios and transceivers, combined with low-cost packaging, enable an optimum blend of capability
and cost.
Kintex UltraScale+ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance
peripherals and cost-effective system implementation with numerous power options for the optimal balance between the required system
performance and the smallest power envelope.
Kintex UltraScale+ Gen 2 FPGAs: Kintex UltraScale+ Gen 2 FPGAs deliver enhanced real-time processing and higher memory bandwidth for
high-performance embedded, test, and broadcast systems. They provide a modernized balance of compute density, connectivity, and power
efficiency to support demanding multi-channel and latency-sensitive applications.
Specs
Product Category: FPGA – Field Programmable Gate Array
Series: XCKU3P
Number of Logic Elements: 355950 LE
Adaptive Logic Modules – ALMs: 20340 ALM
Embedded Memory: 12.7 Mbit
Number of I/Os: 272 I/O
Supply Voltage – Min: 850 mV
Supply Voltage – Max: 850 mV
Minimum Operating Temperature: – 40 C
Maximum Operating Temperature: + 100 C
Data Rate: 16.3 Gb/s
Number of Transceivers: 16 Transceiver
Mounting Style: SMD/SMT
Package / Case: FBGA-676
Brand: AMD / Xilinx
Distributed RAM: 4.7 Mbit
Embedded Block RAM – EBR: 12.7 Mbit
Moisture Sensitive: Yes
Number of Logic Array Blocks – LABs: 20340 LAB
Operating Supply Voltage: 850 mV
Product Type: FPGA – Field Programmable Gate Array
Subcategory: Programmable Logic ICs
Tradename: Kintex UltraScale+
Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM: 31641600 Bits
Number of I/O: 280
Supply Voltage: 0.825-0.876V
Operating Temperature: -40-100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-FCBGA (27×27)
Manufacturer: AMD / Xilinx
Manufacturer PN: XCKU3P-2FFVB676I
