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Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.
Zymet adhesives provide quick and reliable fastening of electronic components to printed circuit boards, offering superior protection against shock, vibration, and thermal stress. As an alternative to underfill processes, edge bonding enhances the impact and bending strength of BGAs and other chip packages, especially when flux residues are present.
Founded in 1986, Zymet manufactures adhesives and encapsulants for electronics and microelectronics assembly. Their product range includes electrically conductive, thermally conductive, anisotropically conductive, ultra-low stress, and optoelectronics adhesives. Their encapsulants encompass UV curable glob top, dam-and-fill, and underfill types, including flip chip and reworkable CSP and BGA encapsulants. A PCB manufacturer facing inconsistency with corner and edge bonding due to underfill variability sought a reworkable solution to increase reliability.
ADHESIVES
Reworkable Edgebond Adhesives
Edgebond adhesives, also known as corner glues or cornerbond adhesives, are an excellent alternative to board-level underfills. They reduce process costs by eliminating the need for board preheat and capillary flow, improve quality by preventing voids and flux residue incompatibility, and make rework easier and more effective.
Zymet’s reworkable edgebond adhesives enhance board-level reliability and strengthen 3D and 2.5D packages, FO-WLPs, WLCSPs, BGAs, CSPs, and QFNs, making them suitable for high-performance, enterprise, automotive, aerospace, and consumer applications.
Features:
- High Tg and low CTE for challenging assemblies and applications
- Fast, in-line curing with cure times as short as 1 minute
- Moderate temperature cure
- Long pot life
- Excellent adhesion
Anisotropically Conductive Adhesives
ACPs for Electrical Interconnection
Zymet’s anisotropically conductive pastes (ACPs) are used for flip chip attachment in applications such as chip-on-glass (COG) and chip-on-flex for RFID and smartcard assembly.
Features:
- Gold-coated spherical polymer particles as fine as 3 microns
- High stability of dispersion for random particle distribution
- High electrical isolation to prevent short circuits
- Fine pitch resolution as fine as 35 microns
- Thermal or UV curing in 10 seconds or less
ACPs for Electrical Grounding
ACPs for electrical grounding use uniformly sized, spherical conductive particles to create electrical contact between two substrates.
Features:
- One-component, syringe dispensable systems
- Low and stable contact resistance
- Snap curing in 60 seconds or less
- Ultra-low stress bonding
Electrically Conductive Adhesives
Die Attach Adhesives
Zymet’s electrically conductive die attach adhesives are used in semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly.
Features:
- Low volume resistivity
- Low ionic contamination
- Tailored viscosity and rheology for automated dispensing
- Snap curing in less than 60 seconds
General Purpose Adhesives
Zymet’s general-purpose electrically conductive adhesives are for component attach, wire attach, and PCB repair. They are available in one- and two-component versions, with varying viscosities.
Thermally Conductive Adhesives
Thermally conductive adhesives from Zymet are designed to dissipate heat efficiently, with high thermal contact conductance and fast curing times.
Features:
- High thermal contact conductance coefficient
- One-component systems for ease of use
- Fast curing in ovens
- Low ionic contamination
- Available in ultra-low stress variants
Non-Conductive Pastes (NCPs)
Zymet’s NCPs are designed for flip chip attachment of gold bumped ICs, specifically for RFID and smartcard assembly, with fast curing and excellent adhesion.
Features:
- Curing in as little as 5 seconds
- Moderate temperature cure
- Excellent adhesion to organic substrates
- Superior performance in bending tests
- Excellent resistance to 85ºC/85% RH
Optoelectronics Adhesives
These adhesives are ideal for optical fiber, connector, ferrule, VCSEL, and Bragg Grating assembly.
Features:
- One-component, syringe dispensable systems
- Excellent adhesion to fused quartz, glass, ceramics, and metals
- Resistance to heat and humidity
- Thermal or UV curing in 10 seconds or less
Ultra-Low Stress Adhesives
These adhesives are designed for bonding stress-sensitive devices.
ENCAPSULANTS
Underfill Encapsulants
Zymet’s high-reliability underfill encapsulants enhance board-level reliability and ruggedize components, making them ideal for enterprise, automotive, and other harsh environments.
Features:
- High Tg
- Low CTE
- Low viscosity
- Fast cures
- Excellent adhesion to organic substrates
- Excellent fracture toughness
Reworkable Underfill Encapsulants
These encapsulants are designed to enhance the board-level reliability of area array packages in harsh environments.
Features:
- Reworkability
- Dispensible with low-cost pneumatic dispensers
- Fast flow into fine gaps
- Fast inline curing
- Long pot life
UV Curable Glob Top and Dam-and-Fill Encapsulants
Zymet’s UV curable encapsulants offer quick, low-temperature curing with properties similar to conventional heat-cured encapsulants.
Features:
- Fast curing, in 10-30 seconds
- Low temperature curing
- High Tg
- Low CTE
- Excellent adhesion to organic substrates
- Low ionic contamination
- Long room temperature stability
