3D PLUS is a world-leading supplier of advanced high-density 3D microelectronic products, specializing in bare die and wafer-level stacking technology. 3D PLUS’ solutions cater to the high reliability, high performance, and compact size demands of modern electronics. 3D PLUS’ patented technology portfolio spans from standard package scales to die-size and wafer-level stacking processes, enabling the integration of heterogeneous active, passive, and optoelectronics components.
3D PLUS delivers cutting-edge, highly integrated solutions for aerospace and defense, including applications in space, aviation, military, and other harsh environments. 3D PLUS’ memory products are developed through extensive research and testing to withstand the extreme conditions of aerospace and defense settings.
3D PLUS provides advanced 3D microelectronic products and space-qualified rad-hard vertical stacks, addressing the needs for high reliability, performance, and miniaturization in today’s and tomorrow’s electronics. Their patented technologies support stacking processes from standard packages to die-size and wafer-level, integrating active, passive, optoelectronics, and MEMS/MOEMS devices into highly compact packages.
3D PLUS offers both catalog products and complex System-In-Package (SiP) solutions, bringing significant advantages to electronic designs. 3D PLUS focuses on high-reliability, high-performance, space-saving technologies for industrial, computing/telecommunications, security and defense, avionics, and space markets.
3D PLUS’ products are utilized in high-tech industries such as aerospace, defense, security, and avionics. 3D PLUS serves the global space and defense sectors with applications in telecommunications, Earth observation, navigation, launch and manned space vehicles, science missions, and constellations.
3D PLUS provides a wide range of radiation-tolerant products for space applications, including memories, IP cores, computer cores, interfaces, POL converters, radiation protection ICs, and camera heads. 3D PLUS also offers industrial memory and custom SiP solutions, leveraging their state-of-the-art stacking technology and expertise in design, manufacturing, and testing.
Radiation-Hardened Space Volatile Memory:
- SRAM
- SDRAM
- DDR1 SDRAM
- DDR2 SDRAM
- DDR3 SDRAM
- DDR4 SDRAM
Non-Volatile Memory:
- PROM
- EEPROM
- MRAM
- NOR FLASH
- SPI NOR FLASH
- MNEMOSYNE
- NAND FLASH
- RTIMS FLASH
Radiation Mitigation Solutions:
- REED SOLOMON IP CORE
- RIMC
- Majority Voter
Interfaces:
- LVDS
- LVT
Protection:
- SWITCH
- Latch-up Current Limiter (LCL)
Power Solutions:
- POL Converter
- Termination Regulator
Computer Cores:
- Fusio RT
- Companion Chip
- COMBO
- CASPEX Space Camera Heads (4 Megapixels, 12 Megapixels, 1.3 Megapixels SWIR)
- Space Camera Systems (IRIS)
Industrial Memory:
- DDR4 SDRAM INDUSTRIAL
- DDR3 SDRAM INDUSTRIAL
- NOR FLASH INDUSTRIAL
- NAND FLASH INDUSTRIAL
3D PLUS develops rad-hard non-volatile memory devices with near-commercial state-of-the-art performance, using advanced packaging and radiation hardening techniques combined with cutting-edge commercial technology for space and strategic systems.
Radiation-Tolerant DDR SDRAM Space Memory: In applications where space is at a premium and failure is not an option, traditional memory solutions fall short. 3D PLUS’ BGA packages, consisting of multiple stacked dies, are optimized for size, weight, and power in military and commercial aerospace applications. Their products support the space industry’s needs for robust devices that withstand radiation effects, offering optimized power consumption and small-footprint packages.
3D PLUS provides advanced DDR memory solutions for challenging space environments, ranging from 2 Gb to 8 Gb. 3D PLUS’ Radiation-Tolerant DDR SDRAM stacks deliver high density and high-speed performance, capable of speeds up to 400 MT/s at 2.5 V, with various data bus widths including x16b, x32b, and x72b. These are the highest density and fastest space-qualified DDR options available.
Available in compact SOP or BGA packages, 3D PLUS’ DDR1 modules are engineered for high-resistance Surface Mount (SMT) assembly, ensuring they withstand the harsh thermal and mechanical conditions typical of space missions. First released in 2009, 3D PLUS’ SDRAM products have become a staple in high-performance computer boards, providing fast processor RAM and high-density storage in Solid State Data Recorder boards.
Renowned for their reliability, 3D PLUS space memories are deployed across a wide array of space applications, from scientific exploration to deep space missions. 3D PLUS’ radiation-tolerant DDR SDRAM has been integral to missions such as Formosta-5, SWOT, Exomars 2022, among others. As the demand for rad-hard and radiation-tolerant memory solutions grows, 3D PLUS remains at the forefront, offering unparalleled performance and durability for the most demanding space environments.
ORDERING INFORMATION
3D PLUS is a leading supplier of high-performance microelectronic components for the defense and space markets. In the defense sector, they provide advanced 3D stacked memory modules, radiation-hardened components, and high-density packaging solutions that meet stringent military standards for reliability and durability. For space applications, 3D PLUS offers space-grade memory, data processing units, and power management systems essential for satellite and spacecraft missions. Their innovative 3D packaging technology ensures compact, lightweight, and robust solutions, making them the preferred choice for critical applications in these demanding environments.
As of 2024, with over 210,000 modules in space and more than 25 years of flight heritage with zero failures, 3D PLUS stands as Europe’s largest manufacturer of hybrid space-qualified catalog products and custom system-in-packages (SiPs).
For more than 25 years, 3D PLUS has been recognized for its innovation in designing and manufacturing miniaturized 3D modules. Their technology enables stacking heterogeneous active, passive, and opto-electronic devices in a single, highly miniaturized package.
3D PLUS offers high-reliability and high-performance products thanks to their expertise in designing complex electronic modules and their technical capabilities in areas such as digital, analog, and IP cores. Combined with strong space radiation expertise, these capabilities enable them to deliver key advantages for all kinds of space missions with a high level of reliability.
3D PLUS’s standard products and custom solutions bring breakthrough advantages to their customers’ electronic designs. They are used in various computer boards, data recorder boards, and custom applications for buses and payloads. Their flight heritage continues to expand, with products launched into space every month in GEO, MEO, and LEO orbits, for deep space exploration missions, satellite constellation fleets, and governmental missions.
