3D Plus

3D PLUS is a world-leading supplier of advanced high-density 3D microelectronic products and flexible stacking technologies designed to meet the most demanding reliability requirements. The company specializes in compact, high-performance solutions for aerospace, defense, security, avionics, industrial, and embedded system applications.

With more than 200,000 modules operating in space and over 25 years of flight heritage with no reported failures, 3D PLUS is a trusted partner to the global space and defense industry. Its technologies support a wide range of missions and platforms, including telecommunications, Earth observation, navigation, launch systems, crewed spacecraft, scientific missions, and satellite constellations.

3D PLUS offers a broad portfolio of products and solutions, including memory and IP cores, computer cores, interfaces, point-of-load (POL) converters, peripherals, radiation protection ICs, camera heads, and custom System-in-Package (SiP) solutions.

The company’s patented, leading-edge stacking technologies span from standard packages to die-size and wafer-level stacking. While process flows may vary, all 3D PLUS stacking solutions are built on four fundamental principles:

High-density stacking of heterogeneous, non-modified standard die, wafers, packages, and passive components

Excellent manufacturing yield enabled by individual test and screening of each layer prior to stacking

Highly reliable metal edge-interconnection techniques using cold processes

Use of simple, robust, and well-proven technologies