YMTC

Yangtze Memory Technologies (YMTC) is a semiconductor Integrated Device Manufacturer (IDM) focused on 3D NAND flash memory. The company provides a fully integrated value chain, including chip design, manufacturing, packaging, testing, and system-level solutions. Since 2017, YMTC has achieved mass production of 32-layer, 64-layer, 128-layer, and 232-layer 3D NAND products. In late 2022, it introduced its fifth-generation 294-layer TLC NAND based on the advanced X4-9070 stacked architecture.

Xtacking is YMTC’s proprietary 3D NAND architecture that separates the memory cell array and peripheral logic (I/O) circuits onto two individual wafers. These wafers are then bonded together through millions of vertical interconnect accesses (VIAs) in a single step. This design enables higher bit density, faster I/O performance, and more flexible, efficient manufacturing.