Zymet

Founded in 1986, Zymet specializes in the development and manufacturing of advanced adhesives and encapsulants for electronics and microelectronics assembly.

Zymet’s product portfolio includes:

Adhesives such as electrically and thermally conductive adhesives, ultra-low stress adhesives, anisotropically conductive (ACPs) and non-conductive pastes (NCPs), as well as specialized adhesives for optoelectronic applications.

Encapsulants including UV-curable glob top encapsulants, dam-and-fill systems, and underfill encapsulants. Their underfill offerings support a range of applications, including flip chip, wafer-level packages (WLPs), chip-scale packages (CSPs), ball grid arrays (BGAs), and package-on-package (POP) assemblies, with both standard and reworkable options available.

Zymet’s materials are engineered for high reliability in demanding assembly processes such as die and wire bonding, flip chip, and multichip packaging.