Description
144828 LOCTITE® Chipbonder® 3563™ Snap Cure, Capillary Flow Epoxy Underfill, 10 mL Syringe
LOCTITE® 3563 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.
Loctite 144828 Specifications:
Series: 3563
Product Type: Epoxy Adhesive
Hardness: 88Shore D
Color: White
Primary Color: White
Physical Form: Liquid
Cure Time: >5min
Viscosity Measurement: 5000 to 12000mPa/s
Chemical Composition: Epoxy Resin, Silica, Epoxy Resin Modifier, 2-Propyl-1h-Imidazole, Imidazole
Specific Gravity: 1.52
VOCs Content: 8.27g/L
Odor: Odorless
Cure Type: Heat Cure
Dielectric Strength: 33.5kV/mm
Elongation at Break: 3%
Gel Time: 12h
Tensile Strength: 10000psi
Container Capacity: 10ml
Applications: Underfill for Flip Chip Devices
Series: LOCTITE® 3563
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: henkel-loctite-adhesive-sourcebook.pdf
