Description
2976560 LOCTITE® Ablestik ABP 8068TI Adhesive, 1-Part Heat cure, Epoxy, Liquid used to Bond PPF leadframe, Ag, and Au, Silver Electronics
LOCTITE ABLESTIK ABP 8068TI is a silver-filled, pressure less die attach adhesive designed for semiconductor packages with high thermal and electrical requirements. This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages. ABLESTIK ABP 8068TI has shown a better thermal performance compared to a solder paste material.
Specs
Manufacturer: Loctite
Product Category: Adhesive Tapes
RoHS:
Brand: Loctite
Product Type: Tape
Series: ABP 8068TI
Subcategory: Supplies
Tradename: Ablestik
Unit Weight: 1.763698 oz
Series: LOCTITE® Ablestik ABP 8068TI
Type: Adhesive
Features: Heat Cure, Silver
For Use With: Electronics
Datasheet: henkel-loctite-adhesive-sourcebook.pdf
