Description
2978131 LOCTITE® SI 5643 Silicone Heat Cure, Pail, two-component, fast-curing, low-viscosity, thermally conductive silicone potting compounds developed for high-performance power electronics.
Brand Loctite
Application Type Potting
1 Part or 2 Part 2-Part
Material Form Liquid
Industry Electronic assemblies
Manufacturer Henkel
Chemistry Silicone
Cure Method 2-Part cure, Heat, Room temperature, Addition cure
Cure Temperature (°C) 30, 25
Cure Time (min) Fast, 1,296,000, 1,440
Viscosity (cPs) Low, Self-leveling, 5,500
Volume Resistivity (O) >1e11 (Ohm.cm)
Series: LOCTITE® SI 5643
Type: Silicone
Features: Heat Cure, Yellow
For Use With: Electronics
Datasheet: Henkel-Thermal-Potting-for-EV-Components-WP
