Description
373041 LOCTITE® 3568™ Reworkable Underfill Epoxy, 10 mL Syringe 10/CA, LOCTITE 3568 is an epoxy based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and μBGA assemblies.
LOCTITE 3568 is an epoxy based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and BGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.
Series: LOCTITE® 3568
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: henkel-loctite-adhesive-sourcebook.pdf
