Description
379965 LOCTITE® ECCOBOND FP4531 Epoxy Heat Cure Multi Series HYSOL™ FP4531™ Snap Cure Underfill Epoxy, (FLIPCHIP UNDERFILL) 30mL Syringe, Black. Experience lOCTITE ECCOBOND FP4531 is a high-performance underfill encapsulant used for semiconductor packaging. Delivers excellent adhesion, thermal cycling performance, and safeguarding for flip chip applications. Order now to experience quality and reliability.
The Loctite 379965 Specifications:
Brand: Hysol®
Series: FP4531
Product Type: Epoxy Adhesive
Color: Black
Primary Color: Black
Cure Time: 7min
Viscosity Measurement: 10000mPa/s
Shelf Life: 9month
Cure Type: Heat Cure
Gel Time: 6min
Container Capacity: 30ml
Container Type: Syringe
Applications: CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board Flip-Chip on Flex Capillary Non-Reworkable Csp Underfill, Capillary Flow
Series: LOCTITE® ECCOBOND FP4531
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: henkel-loctite-adhesive-sourcebook.pdf
