Description
Analog Devices 3B02 is an 8-channel backplane used to mount and interconnect 3B Series signal conditioning modules. It provides power and signal routing for up to eight individual plug-in modules used in industrial and instrumentation applications.
Model: 3B02
Type: Backplane for 3B Series Modules
Channels: 8 independent module slots
Module Compatibility: Analog Devices 3B Series (e.g., 3B30, 3B31, 3B40, etc.)
Power Supply Input: ±15 VDC (typical)
Signal Output: Unipolar or bipolar analog signal (typically ±5 V or 0–5 V)
Connection Interface:
– Screw terminals for field wiring
– 26-pin ribbon connector for system I/O
– Terminals for ±15V DC power input
Isolation: Maintains full isolation per module specifications
Mounting: DIN rail or panel mount
Dimensions: Approx. 7.2″ L x 5.1″ W x 1.2″ H
Application: Signal conditioning, industrial data acquisition, process control
Manufacturer: Analog Devices
Made In: USA
This backplane is ideal for applications requiring centralized signal conditioning and easy interface between field sensors and data acquisition systems.
Analog Devices Inc. 3B02 is a versatile electronic component, categorized as a backplane for the 3B series. This component is supplied in bulk packaging and is engineered for robust performance in demanding applications. The 3B02 serves as a critical interface within systems requiring high-density signal conditioning and data acquisition. Its design facilitates the integration of multiple 3B Series signal conditioning modules, enabling a streamlined and efficient system architecture. This backplane is commonly employed in industrial automation, process control, and test and measurement equipment where reliable and scalable signal processing is paramount. The Analog Devices Inc. 3B02 provides a foundational element for building sophisticated data acquisition systems.
To address diverse applications, the 3B Subsystem Series was designed to provide a complete signal conditioning solution. The 3B02 is designed for 8 channels to offer users the flexibility to match the size of a system to specific applications. All backplanes are provided with #6-32 x 1-inch screws and standoffs for mounting. Several mounting options are available, including rack, surface and NEMA enclosure.
All 3B Series modules feature a universal pin out and can be easily tailored to fit the user’s application. Each backplane can accommodate any 3B Series module in a “Mix and Match” arrangement. Modules are “Hot Swappable”; power does not have to be removed when inserting or removing any module on the backplane. All backplanes provide a four screw terminal for each individual channel’s input field connections. These connections satisfy all transducer inputs and provide transducer excitation when necessary. A cold junction temperature sensor is also supplied on each channel to accommodate thermocouple input modules. Each channel has two screw terminals for the output connections for the 4-20 mA output signal. Two 26-pin system connectors provide high level voltage I/O for all channels.
Obsolete
The 3B Series of Signal Conditioning I/o Subsystems provide a low-cost, versatile method of transferring analog transducer signals to a data acquisition, monitoring or control system without the inherent noise, non-linearity, drift and extraneous voltages. The modules are designed to directly accept analog signals from Thermocouples, RTD’s, AC and DC Strain Gages, Torque Transducers, Frequency Transducers, LVDTs, millivolt or process current signals. The modules amplify, isolate, linearize and convert the transducer output signals to standardized analog inputs for high-level analog I/O subsystems. The 3B Series Subsystem consists of a 10” relay rack with universal mounting backplane and a family of plug-in (up to 16 per rack) input and output signal conditioning modules
Specs: Analog Devices 3B02
