Description
The DP-270 CLEAR 1.7 FL OZ is a Scotch-Weld™ Epoxy Potting Compound/Adhesive, two-part low viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many electronic components and is clear. Electrical insulation properties under high humidity conditions. Ideal for the potting and encapsulation of many heat sensitive or delicate components such as glass diodes and sensors as well as for transformers, coils, chokes, relays.
- Good thermal shock resistance
- Excellent electrical properties
- Non-corrosive to copper
- Long work life
- Negligible exotherm
- >200°F Flash point
- >300°F Boiling point
- 1.15g/ml Density
- ≤27PSIA Vapor pressure
- 1.15 Specific gravity
Manufacturer:3M Electronic Solutions
Datasheet:3M/270.pdf
