Description
498511 LOCTITE® ECCOBOND FP4323 Epoxy Encapsulant, Low CTE, Heat Cure Multi Series
LOCTITE ECCOBOND FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip. LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
Series: LOCTITE® ECCOBOND FP4323
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: LOCTITE-ECCOBOND-FP4323-en_GL
