Description
498513 LOCTITE® ECCOBOND FP4323 Epoxy Heat Cure Multi Series, Liquid Epoxy Encapsulant, 10cc Syringe, FP4323 Series
LOCTITE ECCOBOND FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip. LOCTITE ECCOBOND FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
The Loctite 498513 Features:
Low CTE for improved thermal cycling
High purity
Thixotropic
Excellent moisture resistance
Excellent chemical resistance
The Loctite 498513 Specifications:
Brand: Hysol®
Series: FP4323
Product Type: Epoxy Adhesive
Hardness: 97Shore D
Material Compatibility: Plastic
Color: Black
Primary Color: Black
Physical Form: Viscosity Liquid
Cure Time: 1h
Viscosity Measurement: Part A:172500 Part B:250000mPa/s
Shelf Life: 12month
Chemical Composition: Silicon Dioxide, Hexahydromethylphthalic Anhydride, Bisphenol A Diglycidyl Ether, Epoxy Resin, Substituted Phthalic Anhydride, Trimellitic Anhydride, Epoxy Resin, Substituted Silane, Carbon Black, Resin Modifier
Specific Gravity: 1.8
VOCs Content: 0%
Odor: Aromatic
Cure Type: Heat Cure
Gel Time: 11min
Container Capacity: 10cc
Container Type: Syringe
Applications: Encapsulant-Glob Top, Chip-On-Board and Plastic PGA
Package Quantity: 30CH
Series: LOCTITE® ECCOBOND FP4323
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: Henkel Electronic Materials-34899_498513-ENG-SDS_VD
