Description
623567 LOCTITE® 3128 EFD Black One-Part Epoxy Adhesive – 30 ml Syringe
LOCTITE 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
Structural adhesives LOCTITE® 3128 High-performance structural bonder for heat-sensitive components 1-part epoxy adhesive designed to cure at low temperatures. Provides quick and powerful adhesion on delicate electronic components.
LOCTITE® 3128 is a 1-part, heat-curable epoxy designed for use on small, heat-sensitive components. Typical applications include things like memory cards and CCD/CMOS assemblies. It cures at low temperature and gives excellent adhesion on a wide range of materials in a considerably short amount of time. Performs particularly well when low curing temperatures are required for heat-sensitive components.
Excellent adhesion on a wide range of materials
Fast-acting
Perfect for heat-sensitive components
Heat-curable at low temperatures of 80°C (176°F)
Series: LOCTITE® 3128
Type: Epoxy
Features: Heat Cure, 30mL
For Use With: Heat Sensitive Components
Datasheet: LOCTITE-3128-en_GL.pdf
