Description
BDN09-3CB CTS Heat Sink Passive Pin Array Adhesive 26.9C/W .91″SQ Anodized RoHS
Features
Natural convection is 26.9
With pre-applied adhesive, just peel off the release liner and press onto the component
Reduces assembly costs; no more messy adhesives or greases required
Excellent mechanical bond
Thermally optimized pin fin
Omnidirectional
Adhesive shear strength at 100C is 36psi (a one inch square heat sink would require a 36lb. force to remove heat sink)
Applicable for BGA, PGA, PLCC, and QFP packages
Technical Attributes
Type Passive
Product Dimensions 23.114 x 23.114 x 9.017 mm
Product Length 23.114 mm
Fin Style Pin Array
Manufacturer Part Number: BDN09-3CB
CTS Electronic Components
