Description
CXDB6CCDM-MA-M CXMT Memory LPDDR4X 8GB 4266Mbps 200FBGA DDR SDRAM Memory Chip IC Integrated Circuits Electronic Components
Category Memory/SDRAM
Manufacturer CXMT
Package BGA-200
The CXMT CXDB6CCDM-MA die was found inside CXMT CXDB6CCDM-MA LPDDR4X DRAM package. The CXDB6CCDM-MA was extracted from the Tecno SPARK 20 smartphone. The Tecno SPARK 20 is a smartphone powered by the MediaTek MT6769Z Helio G85 SoC. It features 256 GB internal storage and 8 GB of RAM. This memory floorplan analysis (MFR) explores the CXMT CXDB6CCDM-MA die.
The CXMT CXDB6CCDM-MA is a FBGA package measuring 15.0 mm × 10.0 mm × 0.78 mm thick, with 200 solder balls at the bottom. The CXDB6CCDM-MA package contains eight 8 Gb LPDDR4X DRAM dies. The CXDB6CCDM-MA die measures 4.87 × mm × 9.17 mm (44.66 mm2) as measured from the die seals or 4.96 × mm × 9.26 mm (45.93 mm2) for the full die. The dies are devoid of any salient markings.
Advanced IC Technology:Embrace cutting-edge technology with the H54G66BYJX104R IC, a testament to innovation in semiconductors.
Robust Design:With a 105℃ vapor emission of ≤MSMWTRPM, the chip’s robust design withstands high temperatures.
Low Power Consumption:The IC operates efficiently with a 3dB bandwidth, minimizing power usage in your devices.
Wide Compatibility:The H54G66BYJX104R IC is customizable for a broad range of applications, enhancing its adaptability.
H54g66byyjx104r Ic Support Model|H54g66byyjx104r Ic|High-Speed Performance:Achieve lightning-fast data transfer with LPDDR4X 8GB 4266Mbps 200FBGA 64Gb, ensuring smooth operation.
Datasheet: CXDB6CCBM-MA-A
