Description
EC-1031 RESIN EPOXY POTTING COMPOUND ROHS Low CTE Epoxy Potting Compound
Adding fillers to epoxies naturally decrease the coefficient of thermal expansion (CTE) which is crucial to maintaining strong adhesion to substrates and crack resistance. Fillers including metals, metal oxides, ceramics, and minerals reduce the CTE of epoxy to generally below 40 ppm/°C. When choosing the right epoxy potting compound it is important to consider the CTE of the potting compound and the substrate.
EC-1031M is a room temperature cure, mineral filled epoxy potting compound. The mixed system flows very well and is low in viscosity for easy potting. It cures are room temperature and can cure quickly at temperatures of 50°C and higher. Typical applications for EC-1031M include potting of battery packs, transformers, capacitors, and other electronic components.
| No.of Components | 2 |
| Mix Ratio by Weight | 100/6 |
| Mixed Viscosity @RT(cps) | 4000-8000 |
| Pot Life @25°C(100 gram) | 1-2 hrs |
| Recommended Cure | 2 hrs @ 80°C |
| Alternate Cure | 24-48 hrs @ 25°C |
| Color | Black |
| Specific Gravity | 1.55 |
| Hardness(Shore) | D-86 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | |
| Tg(°C) | 88 |
| CTE(Below Tg)10-6/°C | 39 |
| Service Temp.Range | -55°C to 120°C |
| Thermal Conductivity(W/m°K) | 0.35 |
| Volume Resistivity(500 V) | 4.0 x 1015 |
Manufacturer Part Number: EC-1031
Manufacturer: Electronic Components
