Description
H26M41208HPR Hynix eMMC 5.1 8GB 200MB/S 35MB/S 2.7V – FBGA-153(11.5×13), Built-in wear leveling function;Bad block management function;Garbage collection function;ECC error correction function;Power-down data protection function;Secure write protection function;Hardware reset function
Clock Frequency-Max (MHz) 200.00000
JESD-30 Code R-PBGA-B153
Length (mm) 13.0000
Memory Density (bits) 68719476736.0000000000000000
Memory IC Type eMMC
Memory Width 8
Number of Functions 1
Number of Terminals 153
Number of Words (words) 8589934592.0000000000000000
Number of Words Code 8G
Operating Mode SYNCHRONOUS
Operating Temperature-Max (Cel) 105.0
Operating Temperature-Min (Cel) -40.0
Memory Organization 8GX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA153,14X14,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Programming Voltage (V) 3.3
Seated Height-Max (mm) 0.8000
Serial Bus Type EMMC 5.1
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 2.70000
Supply Voltage-Nom (V) 3.3
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch (mm) 0.500
Terminal Position BOTTOM
Type NAND TYPE
Width (mm) 11.5000
Write Protection SOFTWARE
Datasheet: Hynix H26M Series
