Description
QCC-744-2-MQFN56-TR-00-0 Qualcomm RISC-V System on a Chip (SoC) 325MHz 56-QFN
The Qualcomm QCC74xM module integrates Wi-Fi 6, Bluetooth® 5.4, and IEEE 802.15.4 (Thread/Zigbee-ready) in a highly integrated tri-radio system with optional System-in-Package (SiP). At its core is a powerful 32-bit RISC-V processor with DSP, FPU, and up to 325 MHz, backed by 484 KB on-chip SRAM, 48 KB cache, 128 KB ROM, and optional up to 16 MB pSRAM and 8 MB NOR flash. Multimedia features, 35 flexible GPIOs, and rich peripheral options complete the all-in-one solution.
The QCC74xM supports hostless operation, running both protocol stacks and application logic without requiring an external MCU – perfect for power-efficient edge devices. It also operates in RCP or NCP modes for hosted designs. Built on an open FreeRTOS software platform, it includes an open-source SDK via CodeLinaro and a Visual Studio Code IDE extension for fast, adaptable development. Accelerate your IoT roadmap with a scalable platform that reduces cost and complexity.
Category
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Manufacturer
Qualcomm
Series
Qualcomm® QCC740
Packaging
Tape & Reel (TR)
Cut Tape (CT)
Architecture
DSP, MCU
Core Processor
RISC-V
Flash Size
128KB
RAM Size
484KB
Peripherals
I2S, PWM
Connectivity
CANbus, I2C, SDIO, SPI, UART/USART
Speed
325MHz
Operating Temperature
-40°C ~ 105°C
Package / Case
56-VFQFN
Supplier Device Package: 56-QFN
Number of I/O: 35
