Description
TC1-20G Chip Quik Thermal Silicone Compound 20 gram Syringe Product Highlights
? High Density Thermal Paste.
? White, non-curing and non-flowing thermally
conductive heat sink compound.
? Heavily filled with heat-conductive metal oxide.
Provides high thermal conductivity, low bleed and
high temperature stability.
? Electrically insulating (2 x 1015 ohm-cm).
Specifications
Viscosity: 542,000 cP (542,000 mPa?s)
Density: 2.1g/cc
Bleed: 0.23%
Thermal Conductivity: 0.67 W/m?K
Thermal Resistance: 0.16 °C*cm2/W
Electrical Volume Resistivity: 2 x 1015 ohm-cm
Evaporation: 0.38%
Size: 20g Syringe (10cc)
Manufacturer:Electronic Components
Datasheet:Others/TC1-20G.pdf
