Description
W25Q16FWSSIQ Winbond Flash Serial 16M-BIT 1.8V MEMORY WITH UN 8-Pin SOIC RoHS
Specifications
EU RoHSC ompliant
ECCN (US)EAR99
Chip Density (bit)16M
Architecture Sectored
Boot Block No
Block Organization Symmetrical
Address Bus Width (bit)24
Sector Size 4Kbyte x 512
Page Size 256byte
Number of Bits/Word (bit)8
Number of Words 2M
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns)6
Maximum Erase Time (s)25/Chip
Maximum Programming Time (ms)3/Page
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)1.65
Typical Operating Supply Voltage (V)1.8
Maximum Operating Supply Voltage (V)1.95
Programming Voltage (V)1.65 to 1.95
Operating Current (mA)25
Program Current (mA)25/Page
Minimum Operating Temperature (C)-40
Maximum Operating Temperature (C)85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Minimum Endurance (Cycles)100000
Supplier Package SOIC
Standard Package Name SOP
Pin Count 8
Mounting Surface Mount
Package Height 1.8
Package Length 5.28
Package Width 5.28
PCB changed 8
Manufacturer:Electronic Components
Datasheet:Others/w25q16fw.pdf
