Description
Microsemi White Electronic WED3C7410E16MC-400BH9M Microcontrollers/Peripheral ICs MPU 7410E RISC 400MHz CMOS 255-Pin CBGA
The WEDC 7410E multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
Family Name 7410E
Instruction Set ArchitectureRISC
Number of CPU Cores 1
Instruction Cache Size 32KB
Maximum Speed (MHz)400
Multiply Accumulate No
Minimum Operating Temperature (°C)-55
Maximum Operating Temperature (°C)125
Supplier Temperature Grade Military
Pin Count 255
Supplier Package CBGA
Mounting Surface Mount
Package Height 2.5(Max)
Package Length 25.25(Max)
Package Width 21.21(Max)
PCB changed 255
Compliance
RoHSNot Compliant
he WEDC 7410E/SSRAM multichip package is targeted for highperformance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
The WED3C7410E16MC-XBHX multichip package consists of:
7410E AltiVec™ RISC processor
Dedicated 2MB SSRAM L2 cache, configured as 256Kx72
21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)
Core frequency = 450 or 400MHz
Maximum L2 Cache frequency = 200MHz
Maximum 60x Bus frequency = 133MHz**
The WED3C7410E16MC-XBHX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems
Datasheet:WEDCS01578-1.pdf
