Description
XCKU3P-1FFVD900E Xilinx Kintex UltraScale+ Field Programmable Gate Array (FPGA) IC 0.825-0.876V 304I/O 900-BBGA, FCBGA Tray
The AMD UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through innovative technological advancements.
Kintex™ UltraScale FPGAs: High-performance with a focus on price/performance, using both monolithic and stacked silicon interconnect (SSI)
technology. High DSP and block RAM-to-logic ratios and transceivers, combined with low-cost packaging, enable an optimum blend of capability
and cost.
Kintex UltraScale+ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance
peripherals and cost-effective system implementation with numerous power options for the optimal balance between the required system
performance and the smallest power envelope.
Kintex UltraScale+ Gen 2 FPGAs: Kintex UltraScale+ Gen 2 FPGAs deliver enhanced real-time processing and higher memory bandwidth for
high-performance embedded, test, and broadcast systems. They provide a modernized balance of compute density, connectivity, and power
efficiency to support demanding multi-channel and latency-sensitive applications.
Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM: 31641600 Bits
Number of I/O: 304
Supply Voltage: 0.825-0.876V
Operating Temperature: 0-100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-FCBGA (31×31)
Manufacturer: AMD / Xilinx
Manufacturer PN: XCKU3P-1FFVD900E
