RF Components > Micross HiRel
Micross stands out as a premier provider of advanced microelectronic solutions, including components, die, and wafer services. Micross excels in manufacturing RF and Microwave surface mount semiconductor components and hybrids, tailored for space, aerospace, and defense applications. Micross’ extensive access to authorized die and wafer suppliers, coupled with top-tier advanced packaging, assembly, modification, and testing capabilities, enables them to offer unparalleled high-reliability solutions—from bare die to fully packaged devices and comprehensive program life-cycle support.
Micross builds on their legacy of delivering high-reliability semiconductor products to the Aerospace and Defense industries by continuously expanding their product offerings and capabilities. Micross’ standard RF and microwave components are designed to meet the rigorous demands of airborne applications, high MTBF ground-based equipment, and space missions.
Micross Hi-Rel RF Solutions integrates cutting-edge technology to address the most stringent RF and Microwave semiconductor needs in the Space, Aerospace, and Defense sectors. Micross’ proven expertise includes semiconductor circuit and package design, microelectronic assembly, RF testing, and environmental screening, accommodating products up to 50 GHz and extending well into the 40 GHz range.
Micross’ Hi-Rel RF/microwave amplifiers are crucial for military, defense, aerospace, and other critical applications where reliability is mission-critical. These amplifiers meet stringent military standards for reliability, such as MIL-STD-883, which outlines environmental, electrical, mechanical performance, manufacturing criteria, and test procedures for solid-state power amplifiers (SSPAs).
Micross Hi-Rel often collaborates with strategic partners to develop specialized versions of standardized products and custom solutions tailored to specific qualifications or environmental requirements. Micross offers high-speed data converters, microprocessors, memory, analog and logic functions, along with a broad range of semiconductor services such as high-reliability assembly and testing, and package design.
As a leader in advanced, high-reliability microelectronics, Micross provides a comprehensive array of products and services. With unparalleled access to die & wafer suppliers, and a diverse portfolio spanning hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, Micross offers unmatched solutions—from bare die to fully packaged devices, including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs. Micross has been a trusted partner for the aerospace, defense, space, medical, energy, communications, and industrial sectors.
Device Manufacturing
- Microelectronics Assembly
- Eutectic bonding
- Epoxy die bonding
- Wedge and ball bonding
- Wire bonding
- Visual/bond pull inspection
- Pre-seal vacuum bake
- Hermetic solder seal
- Hermetic seam seal
- Non-hermetic epoxy seal
- Ink or engrave marking
- Package lead forming
Device Testing/Screening
- Small Signal RF (DC to 40 GHz)
- Large Signal RF (DC to 40 GHz)
- Data Recording
- Fixture De-embedding
- DC Parameters
- Custom ATE Development
- MIL-STD 750
- MIL-STD 883
- MIL-STD 19500
- MIL-PRF 38534
- MIL-PRF 38535
Device Evaluation/Qualification
- Product Realization
- Element Evaluation
- Wafer Lot Acceptance
- Life Testing
- Destructive Physical Analysis
- Residual Gas Analysis
- Radiation Testing
Program & Component Management
- Counterfeit and Obsolescence
- Customer Design Reviews
- Project Management