Description
QUALCOMM QCA6234X-AM2D-R Atheros IEEE 802.11a/b/g/n WLAN and Bluetooth v4.0 (BLE) Combo Module Chip, Class 1.5, 113-Pin LGA, RoHS, Reel
The QCA6234X-AM2D from Qualcomm Technologies is a highly integrated, surface-mount wireless connectivity module combining WLAN and Bluetooth functionality in a single LGA package. This chip supports dual-band Wi-Fi (2.4GHz and 5GHz) compliant with the IEEE 802.11a/b/g/n standard, achieving a maximum PHY data rate of 144.4 Mbps. It also integrates Bluetooth 4.0 with Low Energy (BLE) support via a UART interface. With an operating temperature range of -20°C to 85°C and a compact 9.2×9.2mm footprint, it is engineered for space-constrained embedded applications requiring reliable wireless communication, such as IoT gateways, portable consumer electronics, and industrial control systems.
Features
Dual-Band Wi-Fi Connectivity: Supports 2.4GHz (2412-2484 MHz) and 5GHz (5180-5925 MHz) bands, compliant with IEEE 802.11a/b/g/n for flexible network integration.
Integrated Bluetooth 4.0 with BLE: Combines classic Bluetooth and Bluetooth Low Energy (v4.0) functionality, enabling low-power peripheral connectivity and data transfer.
Compact LGA Module Design: Features a pre-certified module in a 9.2×9.2×1.04mm LGA-113 package, simplifying RF design and reducing time-to-market.
Surface Mount Compatibility: Designed for standard SMT assembly processes, suitable for high-volume manufacturing on modern PCBAs.
Technical Specifications
Part Status: Obsolete
Construction: WLAN+BT
WLAN Standard: IEEE 802.11a/b/g/n
WLAN Max Data Rate: 144.4 Mbps
WLAN Frequency Range: 2412 to 2484 MHz | 5180 to 5925 MHz
WLAN Max Output Power: 19 dBm (Typical)
BT Protocol: Bluetooth v4.0 (BLE)
BT Interface: UART
Operating Temperature: -20°C to 85°C
Mounting Type: Surface Mount
Supplier Package: LGA Module
Pin Count: 113
Pin Configuration and Functions
Pin Configuration: This component is supplied as a fully integrated LGA module. The 113-pin land grid array includes pins for power supplies (VDD), grounds (GND), RF interfaces (WLAN/BT antenna), PCIe, UART, SDIO, GPIOs, and other control signals. A detailed pinout diagram and function description must be obtained from the official Qualcomm QCA6234X datasheet for proper PCB layout and connection.
Typical Applications
IoT Gateways and Hubs: Providing dual-band Wi-Fi and BLE connectivity for smart home and industrial IoT aggregation points.
Portable Media Devices: Enabling wireless audio streaming and network access in tablets, handheld gaming consoles, and digital picture frames.
Embedded Systems: Adding wireless communication to industrial controllers, telemetry units, and point-of-sale terminals.
Equivalent / Alternative Parts
QCA6234X-AM2C (Qualcomm): Likely a variant in the same series; verify pin compatibility and firmware support with the manufacturer.
QCA6234-AM2D (Qualcomm): A potential direct alternative; confirm parameter consistency and package matching.
Advantages
Reduced Design Complexity: The pre-certified module solution minimizes challenging RF circuit design and regulatory certification efforts for the end product.
Space-Efficient Integration: Combines dual-band WLAN and Bluetooth/BLE radios into a single compact package, saving valuable PCB area in dense designs.
Simplified Supply Chain: Sourcing a complete module can streamline procurement and assembly compared to discrete chipset solutions.
Limitations
Obsolete Part Status: This component is marked as obsolete, meaning it is not recommended for new designs and long-term supply may be limited.
Moderate Operating Temperature Range: The -20°C to 85°C range may not be suitable for applications requiring extended industrial or automotive temperature grades.
Fixed Feature Set: As a module, its wireless standards and features are fixed and cannot be upgraded beyond the supported 802.11n and Bluetooth 4.0.
Package Information
LGA-113 package (Land Grid Array), dimensions 9.2mm x 9.2mm x 1.04mm, 113 pins, supplied in tray packaging for surface mount assembly.
Datasheet:Qualcomm/qca6234_datasheet.pdf
