ZYMET: Underfill Encapsulant

Description

Zymet reworkable underfill encapsulant, CN-1531, designed for CSP and BGA encapsulation. It is a higher Tg version of the previously introduced CN-1432, with a Tg of 110 degrees C instead of 70 degrees C, for more severe thermal cycle requirements. CSPs and BGAs are not normally encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations. With this reworkable underfill encapsulant, removal of defective CSPs and BGAs is easily accomplished by heating the component and the underfill encapsulant to 220 degrees C. Underfill encapsulants are easily scraped or brushed off. CN-1531 has a viscosity of 5,000 cps at room temperature, making it very easy to dispense. It is also fast flowing, capable of flowing a distance of 18 mm with only a single-side dispense in as little as 15 seconds.

Raise board level reliability for high reliability applications

Zymet’s high reliability underfill encapsulants both ruggedize and enhance board level reliability. Their thermomechanical properties make them suited for enterprise, automotive, and other harsh environment applications. At the same time, they are high speed underfills that offer unsurpassed flow and cure speeds, making them the preferred choice amongst those working with very large packages, including POP’s, BGA’s and FO-WLP’s.

Features include:

• High Tg’s
• Low CTE’s
• Low viscosity
• Fast cures
• Excellent adhesion to organic substrates
• Excellent fracture toughness

Manufacturer:Zymet