Description
CN-1703 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates.
CN-1703 has a viscosity of 500 cps at room
temperature, making it very easy to dispense. It is also
fast flowing, capable of flowing a distance of 18 mm,
with only a single-side dispense, in as little as 10
seconds.
The encapsulant exhibits excellent wetting. It self-fillets,
eliminating the need for seal passes to create complete
and symmetrical fillets. After flow is complete, CN-
1703 can be cured in an in-line oven, in 1 minutes at
150°C.
The excellent processability of CN-1703 makes it suited
to high volume manufacturing of competitive consumer
electronics, such as mobile phones and other handheld
devices.
Zymet is a manufacturer of microelectronic and
electronic adhesives and encapsulants. Its products
include die attach adhesives, substrate adhesives, UV
curable glob top and cavity-fill encapsulants, and
underfill encapsulants.
Manufacturer:Zymet
Datasheet:Zymet-Reworkable_Edgebond_Adhesive.pdf
