Description
Zymet UA-2605-BT2 is a reworkable edgebond adhesive for BGA’s, CSP’s, and other surface mount components.
The adhesive enhances drop and bend test performance as well as improves resistance against shock and
vibration. The adhesive cures quickly at low temperature and exhibits excellent adhesion to organic substrates
UA-2605 improves thermal cycle performance of CBGAs and
plastic BGAs. In one trial, UA-2605 tripled the 0°C to
+100°C performance of a CBGA, to nearly 2500 cycles.
Previously, an underfill was needed to achieve this level
of performance.
The edgebond adhesive is much easier to
process than an underfill. When applying underfill, the
board is preheated to facilitate capillary flow, and multiple
dispense passes are used to deposit sufficient material.
With UA-2605, only four beads of the adhesive are
required, one at each corner (Figure 1). There is no need
to preheat the board, no need to wait for underfill flow, no
need for multiple dispensing passes.
Reworking an underfilled BGA is a time
consuming and delicate task. Underfill residues (Figure 2)
must be removed and, for fine pitch BGAs, the risk of pad
damage is high. With UA-2605, BGA rework is simple
and straightforward. The temperature is raised and the
adhesive is scraped away; then, the BGA is reflowed and
lifted from the board. Little site cleaning is necessary.
Zymet is a manufacturer of microelectronic and
electronic adhesives and encapsulants. Its products
include die attach adhesives, substrate adhesives, UV
curable glob top and cavity-fill encapsulants, and
underfill encapsulants.
