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Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in Central Taiwan Science Park, Taichung, Taiwan. Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan. Winbond’s major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. Winbond’s advantage of technological autonomy and prudent capacity strategy enables us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building the brand image.
Winbond Electronics Corp. – Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include specialty DRAM, mobile RAM, NOR Flash and graphics DRAM with revenues in 2010 of approximately one billion US dollars.
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W25Q128BVEIG Winbond Flash, 128MX1, PDSO8
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W25Q128FVFIG TR Winbond NOR Flash 128Mbit 3.3V 16-SOIC
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W25Q128FVFIG Winbond NOR Flash 128Mbit 3.3V 16-SOIC
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W25Q128FVSIG Winbond NOR Flash 3V/3.3V 128Mb 8-SOIC
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W25Q128FWSIQ Winbond NOR Flash 128M-bit 1.8V 8-SOIC
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W25Q16FWSSIQ Winbond FLASH – NOR Memory IC 16Mb SPI 104MHz 8-SOIC
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W25Q256FVFIQ WINBOND SPIFLASH 256M-BIT 4KB UNIFORM SE RoHS
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W25Q64CVSSIG WINBOND Flash Serial-SPI 3.3V 64Mbit 8M x 8bit 7ns 8-Pin SOIC
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W25Q64FVSSIG Winbond Serial NOR Flash 3V/3.3V 64M-bit 8-SOIC
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W25Q64JVSSIQ Winbond FLASH 64Mbit SPI 133MHZ 8SOIC
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W25R256JVEIN Winbond NOR Flash 256Mbit SPI 3V 8-WSON
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W949D6KBHX5E WINBOND DRAM CHIP MOBILE LPDDR SDRAM 8GBIT 512MX16 X16, 200MHZ 1.8V 60-PIN VFBGA RoHS





