When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
Henkel, headquartered in Düsseldorf, Germany, has about 55,000 employees worldwide and is among the most internationally aligned German-based companies in the global marketplace. People in approximately 125 countries around the world trust in brands and technologies from Henkel.
In 1999, Henkel Corporation acquired The Dexter Corporation and has continued the unrivalled product development and leading-edge manufacturing solutions that have been associated with the Hysol brand name since its inception.
Products:
Coatings
Molding
Potting & Encapsulating
Hysol Coatings:
A layer of a substance applied onto a surface for protection or to enhance visual aesthetics.
Hysol Molding :
To create a shape or form using powder or liquids.
Hysol Potting & Encapsulating:
Compounds used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the exposure to chemicals, moisture, mechanical shock and vibration.
Hysol Adhesives Characteristics:Created with an environmentally conscious mindset that matches current legislation requirements, LOCTITE Hysol solutions bring new vision to your production processes. From innovative formulations and liquid encapsulants to mold compounds, package level underfills and beyond, performance and reliability come together with LOCTITE Hysol.
Acrylic Adhesives
Designed for strength and durability, Hysol acrylic adhesives offer fast setting times, environmental resistance and high adhesions for difficult-to-bond substrates.
Epoxy Adhesives
Used to bond metal, wood, glass, ceramic & plastic in diverse applications, these epoxies are available in a variety of formulations and performance levels.
Polyurethane Adhesives
Engineered for strength and flexibility, polyurethane adhesives and sealants work with a range of substrates and applications to deliver long-term dependability.
Hot Melt Adhesives
Built to optimize performance, LOCTITE Hysol hot melts offer a range of open times, eliminating the need for clamps or fixtures while ensuring extended durability.