Description
Loctite 498499 ECCOBOND Liquid Epoxy Encapsulant, 30cc Syringe, Black, FP4322 Series
LOCTITE ECCOBOND FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity of flow control barrier to prevent excessive flow. LOCTITE ECCOBOND FP4322 is suitable for encapsulating bare chips mounted to plastic substrates as well as potting of small hybrid circuit modules. Spot encapsulation of bare chips on ceramic substrates is not suggested in most cases.
Manufacturer: Loctite
Product Category: Chemicals
RoHS:
Brand: Loctite
Product Type: Chemicals
Series: FP4322
Subcategory: Supplies
Tradename: Eccobond
Unit Weight: 1.693150 oz
Series: LOCTITE® ECCOBOND FP4322
Type: Epoxy
Features: Heat Cure
For Use With: Multi Series
Datasheet: henkel-loctite-adhesive-sourcebook.pdf
