Description
Signetics SIG 74F260D 74F260D Logic Gates Dual 5-input Positive-NOR gates
DESCRIPTION 14-pin plastic DIP 14-pin plastic SO COMMERCIAL RANGE VCC 5V ±10%, Tamb N74F260N N74F260D PKG DWG SOT27-1 SOT108-1
PINS Dna, Dnb, Dnc, Dnd, Dne Q0, Q1 Data inputs Data outputs DESCRIPTION 74F (U.L.) HIGH/LOW 1.0/1.0 50/33 LOAD VALUE HIGH/LOW 20µA/0.6mA 1.0mA/20mA
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
H = High voltage level L = Low voltage level X = Don’t care
(Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.) SYMBOL VCC VIN IIN VOUT IOUT Tamb Tstg Supply voltage Input voltage Input current Voltage applied to output in High output state Current applied to output in Low output state Operating free-air temperature range Storage temperature range PARAMETER RATING 0.5 to VCC to +150 UNIT mA °C
LIMITS SYMBOL VCC VIH VIL IIK IOH IOL Tamb Supply voltage High-level input voltage Low-level input voltage Input clamp current High-level output current Low-level output current Operating free-air temperature range 0 PARAMETER MIN NOM 5.0 MAX mA °C UNIT
(Over recommended operating free-air temperature range unless otherwise noted.) LIMITS SYMBOL PARAMETER TEST CONDITIONSNO TAG VCC = MIN, VIL = MAX VIH = MIN, IOH = MAX Low level output voltage Low-level Input clamp voltage Input current at maximum input voltage High-level input current Low-level input current Short-circuit output currentNO TAG Supply current (total) ICCH ICCL VCC = MIN, VIL = MAX VIH = MIN, IOL = MAX VCC = MIN, II = IIK VCC = MAX, = 7.0V VCC = MAX, = 2.7V VCC = MAX, = 0.5V VCC = MAX VCC = MAX VIN=GND ±10%VCC ±5%VCC MIN µA mA TYP
NOTES: 1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at VCC = 5V, Tamb 25°C. 3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last.
Manufacturer:Electronic Components
Datasheet:74F260.pdf
