UA-2605-B Zymet Edgebond Adhesive

UA-2605-B Zymet Reworkable Edgebond Adhesive Enhances^Board Level Reliability of Large WLCSP

SKU: UA-2605-B Category: Tag: Brand:

Description

UA-2605-B Zymet Reworkable Edgebond Adhesive Aromatic urethane acrylate oligomer. It has good hardness, good abrasion resistance and good leveling.^
Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is reduced by the elimination of board preheat and capillary flow. Quality is improved because voids and incompatibility with flux residues are moot. Rework is far easier, further reducing cost. Zymet’s reworkable edgebond adhesives provide all this, as they ruggedize and enhance the board level reliability of challenging electronic assemblies, even for enterprise and automotive applications.
Manufacturer:Electronic Components
Datasheet:zymet-ua-2605-b-may2016.pdf

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